I-Semiconductor ye-Alumina yeCeramic Plate ephindwe kabini kwiSombululo sokuSila soMphezulu

Imodeli yomatshini:  YH2M84100 Umatshini wokuSila weDiski ephindwe kabini

Umsebenzi:  I-Semiconductor yeAlumina yeCeramic Plate-59*59* T 26.45mm

mfuneko:  Umcaba 0.003mm, Parallelism 0.007mm, Uburhabaxa Ra0.8μm;

iziphumo:  Ukucaba≤0.001mm, Parallelism≤0.002mm，Ra0.8μm;

• Usetyenziso oluphambili lwe-semiconductor alumina ceramics:

    1. I-substrate yokupakisha ye-elektroniki: isetyenziselwa ukupakishwa kwe-IC kunye neemodyuli zamandla, kunye ne-insulation ephezulu kunye ne-thermal conductivity. 

    2. I-chip holder: ibonelela ngenkxaso yomatshini, i-insulation kunye nokuzinza kwe-thermal. 

    3. Izinto ze-radiator: ezisetyenziselwa izixhobo eziphezulu zamandla ukuphucula ukusebenza kokutshatyalaliswa kobushushu. 

   4. Izixhobo ze-vacuum kunye neenzwa: ezisetyenziselwa ukuchasana nobushushu obuphezulu kunye neendawo zokumelana nokubola.

• I-semiconductor alumina ye-alumina ye-ceramic sheet yokusila kunye neemfuno zenkqubo yokupolisha:

1.  Ukugaya: Ivili lokusila idayimane liyafuneka ukuze kuqinisekiswe ukuchaneka okuphezulu kwezinto ezinobunzima obuphezulu kunye nokulawula ukucaba kunye noburhabaxa.

2.  Ukupholisha: Ukusetyenzwa kakuhle kwamanyathelo amaninzi ukuqinisekisa ukugqitywa komphezulu kunye nokulungelelanisa izicelo ze-semiconductor ezichanekileyo.

3. Ulawulo lobungakanani: Ukulawula ngokungqongqo ukunyamezelana ukuphepha ukuguquguquka kwe-thermal kunye nokuphambuka komgangatho ukuqinisekisa ukuhambelana kwemveliso.